Method and apparatus for stacking electrical components using via to provide interconnection

ABSTRACT

An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active surface on a back surface of another chip. Electrical connections between chips and leads on the leadframe are facilitated by bonding pads on chip active surfaces and by via that extend from the bonding pads through the chips to the back surfaces.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. application Ser. No.10/987,468, filed Nov. 12, 2004 now U.S. Pat. No. 7,462,925, and is alsoa continuation of U.S. application Ser. No. 11/606,661, filed Nov. 29,2006 now U.S. Pat. No. 7,495,327, the entire contents of both which areincorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to multi-chip stackingfabrication methods and, more particularly, to fabrication of thinpackages containing multi-chips.

2. Description of Related Art

Personal devices that require a large number of electronic components tobe provided in a small volume are rapidly proliferating. A pocket-sizedpersonal music player that includes a hard disk is only one example ofsuch a device. Today's personal electronic devices require that more andmore functionality must be provided in a relatively small space.Traditionally, this functionality was provided by multi-chip electronicdevices fabricated by placing chips on a two-dimensional substrate suchas a printed circuit board (PCB). As circuit density increased, methodswere devised for stacking multiple chips, thereby trading a scarceresource of substrate area for space in a third dimension. Severalprior-art structures for stacking multiple chips have been devised, butnone has proven to be wholly satisfactory. The need to stack componentstypically requires fabricating a superstructure that supports thestacked components. This superstructure adds to the volume and weight,and therefore to the cost, of the component stack, thereby offsetting anadvantage that may be gained by stacking. Some stacking structures makeefficient use of space, but tend to be complicated and expensive tofabricate. Less complicated and expensive stacking structures may eitherfail to make efficient use of space and/or present problems in disposingof the heat generated by chips in a stack. Other stacking structuresinclude delicate wires that may introduce reliability concerns. Stillother stacking structures may introduce reliability concerns at thelevel of PCB interconnection.

A need thus exists in the prior art for a stacking structure that isefficient in its use of space while being easy to fabricate. A furtherneed exists for a structure that achieves reliable interconnection witha PCB.

SUMMARY OF THE INVENTION

The present invention addresses these needs by providing a chip stackingstructure wherein chips have via that extend through the chip, therebyobviating the need for external wires to form electrical connectionseither between chips or with external leads. The invention hereindisclosed comprises a leadframe having a plurality of leads disposed ata periphery of the leadframe. According to an exemplary embodiment, eachlead has a lead inner portion and a lead outer portion. The lead outerportion may connect reliably with a substrate such as a printed circuitboard (PCB). Each lead inner portion comprises a first surface and asecond surface. The invention further may comprise a first chip stackformed of at least one chip, each chip having an active surface, a backsurface, a plurality of first bonding pads disposed inside the activesurface, and a plurality of first chip via. Each first bonding pad has abonding wall, and each first chip via has insulating material coveringan inner wall of the first chip via. The insulating material does notcover a bonding wall. Each of the plurality of first chip via extendsfrom a first bonding pad through the chip to the back surface. Thisembodiment further comprises a second chip stack formed in a mannersimilar to the formation of the first chip stack. Chips in the secondchip stack comprise active surfaces, back surfaces, second bonding pads,and second chip via. The second chip via have insulating materialcovering inner walls thereof. The second bonding pads have bonding wallsthat are not covered by insulating material. This embodiment of the chipstacking structure may be formed by filling each first chip via withconducting material that electrically connects each first bonding pad tothe first surface of a lead inner portion. Similarly, each second chipvia may be filled with conducting material, electrically connecting eachsecond bonding pad to the second surface of a lead inner portion.

Another embodiment of the present invention comprises a chip stackingstructure having a plurality of chip stacks, each chip stack includingat least one chip. Each chip comprises an active surface, acorresponding back surface, and a plurality of bonding pads disposedinside the active surface. Each bonding pad has a bonding wall. Eachchip further comprises a plurality of chip via having inner walls andextending from the plurality of bonding pads through the chips to theback surfaces. Insulating material covers the inner walls but does notcover the bonding walls. The chip stacking structure further comprises aleadframe having a plurality of leads disposed at a periphery thereofwith the plurality of leads having lead inner portions and lead outerportions. The lead inner portions have first surfaces and secondsurfaces. A first chip stack is positioned with a first active surfacefacing the first surfaces and with a first plurality of bonding padsaligned with and making contact with the lead inner portions. A secondchip stack is positioned with a second active surface facing the secondsurfaces and with a second plurality of bonding pads aligned with andmaking contact with the lead inner portions. Conductive materialelectrically connects bonding walls in the first chip stack to the firstsurfaces. Similarly, conductive material electrically connects bondingwalls in the second chip stack to the second surfaces.

The present invention further comprises a method of stackingsemiconductor chips. An implementation of the method comprises providinga leadframe having a plurality of leads disposed at a periphery thereof,the plurality of leads having lead inner portions and lead outerportions. The lead inner portions have first surfaces, second surfaces,and lead via that extend through the lead inner portions. An aspect ofthis implementation of the method comprises providing a first chip stackcomprising at least one chip having an active surface, a back surface,and a plurality of bonding pads inside the active surface. Each chipfurther comprises a plurality of chip via extending from the pluralityof bonding pads through the chip to the back surface. Another aspect ofthe method positions the first chip stack with a first active surfacefacing the first surfaces and with a first plurality of bonding padsaligned with and making contact with the inner portions. A second chipstack also is provided, the second ship stack likewise comprising atleast one chip having an active surface and a back surface. Each chip inthe second chip stack also has a plurality of bonding pads inside theactive surface and a plurality of chip via that extend from theplurality of bonding pads through the chip to the back surface. Themethod further comprises positioning the second chip stack with a secondactive surface of the second chip stack facing the second surfaces suchthat a second plurality of bonding pads of the second chip stack isaligned with and makes contact with the lead inner portions.

While the apparatus and method has or will be described for the sake ofgrammatical fluidity with functional explanations, it is to be expresslyunderstood that the claims, unless expressly formulated under 35 U.S.C.112, are not to be construed as necessarily limited in any way by theconstruction of “means” or “steps” limitations, but are to be accordedthe full scope of the meaning and equivalents of the definition providedby the claims under the judicial doctrine of equivalents, and in thecase where the claims are expressly formulated under 35 U.S.C. 112 areto be accorded full statutory equivalents under 35 U.S.C. 112.

Any feature or combination of features described herein are includedwithin the scope of the present invention provided that the featuresincluded in any such combination are not mutually inconsistent as willbe apparent from the context, this specification, and the knowledge ofone skilled in the art. For purposes of summarizing the presentinvention, certain aspects, advantages and novel features of the presentinvention are described herein. Of course, it is to be understood thatnot necessarily all such aspects, advantages or features will beembodied in any particular embodiment of the present invention.Additional advantages and aspects of the present invention are apparentin the following detailed description and claims that follow.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a plan view of a portion of a leadframe embodiment constructedaccording to the present invention;

FIG. 2 is a plan view of a chip that may connect to the leads of aleadframe of the type illustrated in FIG. 1;

FIG. 3 is a plan view of a partial stacked structure comprising a singlechip connected to the leads of a leadframe;

FIG. 4 is a is a cross-sectional view, taken along the line 4-4′, of thechip/leadframe combination illustrated in FIG. 3;

FIG. 5A is a cross-sectional view of an embodiment of a chip comprisingchip via and bonding pads according to the present invention;

FIG. 5B is a cross-sectional view showing details of a chip via andbonding pad illustrated in FIG. 5A.

FIG. 6 is a cross-sectional view of an embodiment of two chips connectedto a leadframe according to the present invention;

FIGS. 7A-7C are cross-sectional views of embodiments of a stackedstructure comprising two chips configured according to the presentinvention;

FIGS. 7D and 7E are cross-sectional views of modified embodiments of astacked structure comprising two chips not having coaxially aligned chipvia;

FIG. 8 is a cross-sectional view of an embodiment of four chipsconnected to a leadframe according to the present invention;

FIGS. 9A-9C are cross-sectional views of implementations of a stackedstructure comprising four chips arranged according to the presentinvention;

FIGS. 9D and E are cross-sectional views of modified embodiments of astacked structure comprising two pairs of chips, the chip via of onepair not being coaxially aligned with chip via of the other pair ofchips;

FIG. 9F is a cross-sectional view of a stacked chip structure attachedto one side of a lead frame according to the present invention;

FIG. 10 is a plan view of an embodiment of a leadframe comprising asupporting pad according to the present invention;

FIG. 11 is a cross-sectional view of an embodiment of two chipsconnected to a leadframe that comprises a supporting pad according tothe present invention;

FIGS. 12A-12C are cross-sectional views of embodiments of a stackedstructure comprising four chips combined with a leadframe having asupporting pad according to the present invention;

FIG. 13 is a plan view of a four-chip stacked structure formed on aleadframe having a supporting pad according to the present invention;

FIGS. 14A-14C are cross-sectional views of stacked structures comprisingfour chips in an embodiment comprising a leadframe having a supportingpad;

FIGS. 14D and 14E are cross-sectional views of single-sided stackedstructures fabricated according to the present invention; and

FIG. 15 is a flow diagram that describes an implementation of a methodof forming a stacked chip structure according to the present invention.

DETAILED DESCRIPTION OF THE PRESENTLY PREFERRED EMBODIMENTS

Reference will now be made in detail to the presently preferredembodiments of the invention, examples of which are illustrated in theaccompanying drawings. Wherever possible, the same or similar referencenumbers are used in the drawings and the description to refer to thesame or like parts. It should be noted that the drawings are insimplified form and are not to precise scale. In reference to thedisclosure herein, for purposes of convenience and clarity only,directional terms, such as, top, bottom, left, right, up, down, over,above, below, beneath, rear, and front, are used with respect to theaccompanying drawings. Such directional terms should not be construed tolimit the scope of the invention in any manner.

Although the disclosure herein refers to certain illustratedembodiments, it is to be understood that these embodiments are presentedby way of example and not by way of limitation. The intent of thefollowing detailed description, although discussing exemplaryembodiments, is to be construed to cover all modifications,alternatives, and equivalents of the embodiments as may fall within thespirit and scope of the invention as defined by the appended claims. Itis to be understood and appreciated that the process steps andstructures described herein do not cover a complete process flow for themanufacture of stacking structures. The present invention may bepracticed in conjunction with various integrated circuit fabricationtechniques that are conventionally used in the art, and only so much ofthe commonly practiced process steps are included herein as arenecessary to provide an understanding of the present invention.

Referring more particularly to the drawings, FIG. 1 is a plan view of aportion of a leadframe embodiment constructed according to the presentinvention. The portion of the leadframe illustrated in FIG. 1 comprisesa plurality of leads having lead inner portions 130. Each lead innerportion 130 may have a lead via 140 formed therein. The lead innerportions 130 are extended to reach an active surface of a chip that maybe positioned to make contact with the lead inner portions 130. The leadinner portions 130 may be configured without lead via 140 in modifiedembodiments.

FIG. 2 is a plan view of a chip 201 a that may connect to the leads of aleadframe of the type illustrated in FIG. 1. Chip 201 a has an activesurface 211 a and a corresponding back surface 221 a (FIG. 4, infra). Aplurality of first bonding pads 231 a is disposed inside the activesurface 211 a of the chip 201 a. Each first bonding pad 231 a hasassociated with it a first chip via 241 a that extends from the firstbonding pad 231 a through the active surface 211 a of the chip 201 a tothe back surface 221 a (FIG. 4) of the chip 201 a. According to atypical embodiment, the first bonding pads 231 a and their associatedfirst chip via 241 a are fabricated to align with lead inner portions130, which may comprise lead via 140 as illustrated in FIG. 1.

FIG. 3 is a plan view of a partial stacked structure comprising a singlechip connected to the leads of a leadframe. The embodiment illustratedin FIG. 3 comprises a leadframe portion as illustrated in FIG. 1 placedin contact with the chip 201 a illustrated in FIG. 2. Lead via 140 inthe lead inner portions 130 are coaxially aligned with first chip via241 a (FIG. 2). The coaxial alignment of the first chip via 241 a withthe lead via 140 assures that the lead inner portions 130 also alignwith first bonding pads 231 a on the active surface 211 a of the chip201 a. The alignment of first bonding pads 231 a with the lead innerportions 130 assures that first bonding pads 231 a are able to establishelectrical contact with the lead inner portions 130.

FIG. 4 is a cross-sectional view taken along the line 4-4′ of thechip/leadframe combination illustrated in FIG. 3. This view illustratesthe active surface 211 a and the back surface 221 a of the chip 201 a.First bonding pads 231 a formed inside the active surface 211 a connectto first chip via 241 a that extend from first bonding pads 231 athrough the chip 201 a to the back surface 221 a of the chip 201 a. Thelead via 140 are coaxially aligned with first chip via 241 a. Each leadinner portion 130 illustrated in FIG. 4 comprises a first surface 110and a second surface 120. In the illustrated embodiment, the activesurface 211 a of chip 201 a is secured to the first surfaces 110 of thelead inner portions 130 that form a portion of the leadframe.

An electrically conductive material such as solder may be used to fillthe lead via 140 and first chip via 241 a. Solder may flow over firstbonding pads 231 a thereby providing mechanical as well as electricalconnection of the lead inner portions 130 to first bonding pads 231 a.According to another embodiment (not illustrated), chip 201 a has novia, and the first surface 110 of the lead inner portions 130 is securedto the active surface 211 a of chip 201 a by a solid or liquid adhesive.

FIG. 5A is a cross-sectional view of an embodiment of a chip 201 acomprising first chip via 241 a and first bonding pads 231 a accordingto the present invention. Although a chip may comprise many such firstchip via 241 a and first bonding pads 231 a, only two of each are shownin FIG. 5A for clarity. A single first chip via 241 a and its associatedfirst bonding pad 231 a are selected and designated as 240 a for furtherdiscussion below.

FIG. 5B is a cross-sectional view of the selected first chip via 241 aand first bonding pad 231 a designated as 240 a in FIG. 5A. The firstbonding pad 231 a has a bonding wall 230 a. As shown in FIG. 5B, thefirst chip via 241 a may include an insulated coating 239 a on an innerwall of the first chip via 241 a. This insulated coating 239 a, whichdoes not extend to cover the bonding wall 230 a of the first bonding pad231 a, can prevent electrical contact from occurring between conductingmaterial that may be placed within the first chip via 241 a and activeareas internal to the chip 201 a (FIG. 5A). Methods are known in the artfor forming the insulated coating on the inner wall of the first chipvia 241 a. For example, the first chip via 241 a may be formed by aburning operation performed with a laser. The laser, in burning thefirst chip via 241 a, may do so with a temperature high enough tooxidize semiconductor material that forms the chip 201 a. If the chip201 a is formed of silicon, then the oxidized semiconductor material issilicon dioxide, known to be insulating material. Although notspecifically illustrated, the via illustrated in FIGS. 6, 7A-7E, 8,9A-9F, 11, 12A-12C, 13, and 14A-14E may include insulated coatings oninner walls in a manner represented in FIG. 5B.

FIG. 6 is a cross-sectional view of an embodiment of two chips connectedto a leadframe according to the present invention. The lower portion ofthe diagram duplicates FIG. 4 wherein chip 201 a is joined with thefirst surfaces 110 of the lead inner portions 130 on the leadframe. InFIG. 6 another chip 202 a is added to the combination. Chip 202 a has anactive surface 212 a and a back surface 222 a. The active surface 212 ahas formed thereon second bonding pads 232 a, which connect to secondchip via 242 a that extend through the chip 202 a to the back surface222 a. The second chip via 242 a can be formed with an insulated coatingas described above with reference to FIG. 5B. Chip 202 a aligns withchip 201 a and with the lead inner portions 130 so that first chip via241 a, second chip via 242 a, and lead via 140 are coaxially aligned.The alignment assures that second bonding pads 232 a make electricalcontact with the second surfaces 120 of the lead inner portions 130.

In modified embodiments configured without lead via 140, alternativemethods may be employed to create electrical contact between, forexample, first surfaces 110 and first bonding pads 231 a. For example, acoating of conductive material (e.g., solder) may be provided on firstsurfaces 110 to enhance adhesion of a first chip via 241 a to a firstsurface 110. Moreover, convex conductive features (e.g., “bumps”) may beformed on first surfaces 110 in order to enhance alignment and adhesionof first chip via 241 a to first surfaces 110.

FIG. 7A is a cross-sectional view illustrating an embodiment of atwo-chip stacked structure fabricated according to the presentinvention. Generally, this embodiment is configured as illustrated inFIG. 6 except that leads 100 are shown as well. Each lead 100 comprisesan lead inner portion 130 as already described and an outer portion 135.The lead inner portion 130 may comprise lead via 140 that are coaxiallyaligned with first chip via 241 a and second chip via 242 a. The outerportions 135 may serve to provide a reliable electrical and mechanicalconnection to a substrate such as a printed circuit board (PCB). Theillustrated embodiment exposes the respective back surfaces 221 a and222 a of chips 201 a and 202 a, respectively, thereby enhancingdissipation of heat generated by the chips 201 a and 202 a. It should benoted that the embodiment illustrated in FIG. 7A has no active surfaceor wiring exposed. Therefore, this embodiment has no need of anyencapsulation to protect components of the structure. The absence ofencapsulation may promote increased thermal dispersion of heat generatedby chips 201 a and 202 a.

FIG. 7B is a cross-sectional view of another embodiment of a two-chipstacked structure. This embodiment is similar to the embodimentillustrated in FIG. 7A except that parts chips 201 a and 202 a and partsof the leadframe are at least partially encompassed in an enclosure 400.A portion of a region 410 internal to the enclosure 400 may be filledwith, for example, a molding resin, encapsulating the chips 201 a and202 a and lead inner portions. The enclosure 400 in this embodimentencloses the lead inner portions 130 (FIG. 7A), but does not enclose therespective back surfaces 221 a and 222 a of chips 201 a and 202 a,respectively. Thermal dispersion of heat generated by the chips 201 aand 202 a is enhanced by the exposure of the back surfaces 221 a and 222a.

FIG. 7C is a cross-sectional view of yet another embodiment of atwo-chip stacked structure. This embodiment is similar to FIG. 7B exceptthat an enclosure 500 surrounds all surfaces of the chips 201 a and 202a. A region 510 is formed by the enclosure, wherein a material such asmolding resin may occupy a portion of the region 510, encapsulating thechips 201 a and 202 a and lead inner portions.

FIGS. 7D and 7E illustrate examples of modified embodiments of thetwo-chip structures illustrated in, respectively, FIGS. 7A and 7B,wherein first chip via 241 a are not coaxially aligned with second chipvia 242 a. The lead inner portions 130 in the embodiment illustrated inFIG. 7D comprise first lead via 141 and second lead via 142. First leadvia 141 coaxially align with first chip via 241 a; second lead via 142coaxially align with second chip via 242 a. The embodiment illustratedin FIG. 7E is configured in a manner similar to the example shown inFIG. 7D except for the inclusion of an enclosure 400 defining aninternal region 410.

FIG. 8 is a cross-sectional view of an embodiment of four chipsconnected to a leadframe in accordance with the present invention. Thisembodiment is similar to the embodiment illustrated in FIG. 6 with theaddition of chips 201 b and 202 b. Chip 201 b has an active surface 211b and a corresponding back surface 221 b. A plurality of bonding pads231 b is disposed inside the active surface 211 b. Each bonding pad 231b has associated with it a chip via 241 b that extends from the bondingpad 231 b to the back surface 221 b of the chip 201 b. Chip 201 b isstacked under chip 201 a with the active surface 211 b of chip 201 bfacing and establishing contact with the back surface of chip 201 a.

The placement of chip 202 b relative to chip 202 a is similar to theplacement of chip 201 b relative to chip 202 a. Chip 202 b has an activesurface 212 b and a corresponding back surface 222 b. A plurality ofbonding pads 232 b are disposed inside the active surface 212 b, eachbonding pad 232 b being connected to a chip via 242 b. The chip via 242b extend from the bonding pads 232 b to the back surface 222 b. Theactive surface 212 b of chip 202 b faces and contacts the back surface222 a (FIG. 6) of chip 202 a. Corresponding chip via 241 b, 242 b, and(see FIG. 6) 241 a and 242 a as well as lead via 140 are coaxiallyaligned, thereby facilitating electrical contact among the chips 201 a,201 b, 202 a, and 202 b and the lead inner portions 130. In particular,an electrically conductive material such as solder may be used to fillcorresponding chip via 241 b, 242 b, and (see FIG. 6) 241 a, and 242 a,thereby providing electrical connection among the bonding pads 231 b,232 b, and (see FIG. 6) 231 a and 232 a. Solder may flow in the lead via140 (FIG. 6) between first bonding pads 231 a and second bonding pads232 a, thereby providing electrical connection as well to the lead innerportions 130. Accordingly, corresponding bonding pads 231 b, 231 a, 232a, and 232 b may be electrically connected to lead inner portions 130 ofcorresponding leads.

It should be clear from the examples presented herein that the directionin which chips face, i.e. up or down, is not constrained by presentdescription of the invention. Rather, the facing direction of chips canbe chosen according to aspects of a particular design or application.

The structure illustrated in FIG. 8 may be extended by providingadditional chips having active surfaces, back surfaces, bonding pads,and chip via of the type already described. For example, another chipcould be added to the structure by placing the active surface of theadditional chip to face either the back surface 221 b of chip 201 b orthe back surface 222 b of 202 b. Limits to the process of stackingadditional chips, if any, may be imposed, for example, by external spaceconsiderations.

FIG. 9A is a cross-sectional view of an embodiment of a four-chipstacked structure configured according to the present invention. Theembodiment in FIG. 9A should be compared with the embodiment in FIG. 7A,the substantial difference between the two embodiments being theaddition of chips 201 b and 202 b to the structure illustrated in FIG.7A. Again, the exposure of back surfaces 221 b and 222 b in FIG. 9Aenhances the ability of the structure to disperse heat generated by thechips. Electrical connection among chips and the leadframe inner leads110 may be achieved, according to another representative embodiment, bymeans of conducting material (such as solder) that makes contact with abonding wall 230 a (FIG. 5B). The conducting material further may fillvia (e.g., first chip via 241 a illustrated in FIG. 5B and chip via 241b illustrated in FIG. 8) and may make electrical contact with innerleads, e.g. inner lead portions 130 illustrated in FIG. 9A.

FIG. 9B is a cross-sectional view of a stacked structure embodimentcomprising four chips in accordance with the present invention. Thisembodiment relates to the embodiment illustrated in FIG. 9A by theaddition of an enclosure 600 that encloses the chips 201 b, 201 a, 202a, and 202 b and the lead inner portions 130 (FIG. 9A). Molding resinmay partially fill an internal region 710 formed by the enclosure. Themolding resin may encapsulate the chips 201 b, 201 a, 202 a, and 202 band lead inner portions. Back surfaces 221 b and 222 b are exposed inthis embodiment, to dissipate heat generated by the chips 201 b, 201 a,202 a, and 202 b more efficiently.

FIG. 9C is a cross-sectional view of another implementation of afour-chip stacked structure. In the present embodiment, all surfaces ofchips 201 b, 201 a, 202 a, and 202 b are surrounded by an enclosure 700,thereby forming a region 710. As before, molding resin may occupy theregion 710 and encapsulate the chips 201 b, 201 a, 202 a, and 202 b andlead inner portions.

FIGS. 9D-9F depict embodiments of other examples of four-chip structuresfabricated according to the present invention. The embodimentsillustrated in FIGS. 9D and 9E generalize the structures illustrated inrespective FIGS. 9A and 9B to cases where first chip via are notcoaxially aligned with second chip via. FIGS. 9D and 9E are notdescribed in detail because of their similarity to FIGS. 7D and 7E. FIG.9F describes another modified embodiment of a four-chip stackingstructure fabricated according to the present invention. The four chips204 a-204 d illustrated in FIG. 9F are stacked on a single side of thelead inner portions 130 and are connected electrically to the secondsurfaces 120 of the leads.

FIG. 10 is a plan view of an embodiment of a leadframe comprising asupporting pad 300 according to the present invention. The supportingpad 300 in the illustrated embodiment comprises at least one elongatedchip supporting bar 310. (Four elongated chip supporting bars 310 areillustrated in FIG. 10.) The leadframe further comprises leads havinglead inner portions 130 and lead via 140 as described above withreference to FIG. 1.

FIG. 11 is a cross-sectional view of an embodiment of two chips 201 aand 202 a connected to a leadframe that comprises a supporting pad 300according to the present invention. The illustrated embodiment issimilar to the embodiment described above with reference to FIG. 6, butdiffers by the provision of the supporting pad 300. The active surfaces211 a and 212 a of chips 201 a and 202 a may be secured to thesupporting pad 300 in a manner such that the supporting pad 300 does notinterfere with first bonding pads 231 a and second bonding pads 232 a.In typical embodiments, the active surfaces 211 a and 212 a are securedto opposite surfaces of the supporting pad 300 by a non-conductingadhesive. The non-conductive adhesive may be either a solid or a liquid.

FIGS. 12A-12C, 13, and 14A-14D are cross-sectional diagrams illustratingembodiments of various forms of stacked structures that include asupporting pad 300. These embodiments are similar to the embodimentsdescribed with reference to respective FIGS. 7A-7C, 8, 9A-9C, and 9Fexcept for the inclusion of a supporting pad 300 as described above withreference to FIGS. 10 and 11. FIG. 14E is a modified configuration ofFIG. 14D, wherein an upper enclosure 1000 and a lower enclosure 1005define an upper internal region 1010 and a lower internal region 1015,respectively.

FIG. 15 is a flow diagram that describes an implementation of a methodof forming a stacked chip structure according to the present invention.According to the illustrated implementation, a leadframe is provided atstep 1200. An exemplary embodiment of a portion of such a leadframe isillustrated in FIG. 1. The leadframe typically comprises a collection ofleads having lead inner portions 130 and may comprise lead via 140 asalready described. The lead inner portions 130 have first and secondsurfaces 110 and 120 as illustrated in FIG. 4. A first chip stack,having bonding pads and first chip via, is provided at step 1210, thefirst chip stack comprising at least one chip 201 a as illustrated inFIG. 4. As another example, a two-chip stack comprising chips 201 a and201 b is illustrated in FIG. 8. The first chip stack is positioned onthe leadframe at step 1220. Referring to FIG. 4 as an example, the chipstack may be positioned with first chip via 241 a aligned with lead via140. The chip stack is placed such that first bonding pads 231 a insidethe active surface 211 a of the chip 201 a make contact with firstsurfaces 110 of the lead inner portions 130. The alignment of first chipvia 241 a and lead via 140 assures that first bonding pads 231 a arealigned with and make electrical contact with the lead inner portions130. A second chip stack, likewise having bonding pads and chip via, isprovided at step 1230. As illustrated in FIG. 6, the second chip stackmay comprise at least one chip 202 a. The second chip stack ispositioned on the leadframe at step 1240. As with the placement of thefirst chip stack, the second chip stack is positioned such that secondbonding pads 232 a inside active surface 212 a of chip 202 a contactsecond surfaces 120 of the lead inner portions 130. Second chip via 242a are aligned with lead via 140. This arrangement provides electricalcontact between second bonding pads 232 a and the lead inner portions130.

In view of the foregoing, it will be understood by those skilled in theart that the methods of the present invention can facilitate formationof efficient stacking structures for integrated circuits. Theabove-described embodiments have been provided by way of example, andthe present invention is not limited to these examples. Multiplevariations and modification to the disclosed embodiments will occur, tothe extent not mutually exclusive, to those skilled in the art uponconsideration of the foregoing description. For example, the embodimentsillustrated in FIGS. 3, 4, 6, 7A-7E, 8, 9A-9F, 11, 12A-12C, 13, and14A-14D illustrate chips and chip stack sets having an active surfacethat faces the leadframe inner lead surface. Other embodiments maycomprise chips or chip stacks having one or more back surfaces that facethe leadframe inner lead surface. Additionally, other combinations,omissions, substitutions and modifications will be apparent to theskilled artisan in view of the disclosure herein. Accordingly, thepresent invention is not intended to be limited by the disclosedembodiments, but is to be defined by reference to the appended claims.

1. A method of stacking semiconductor chips, comprising: providing alead-frame having a plurality of leads disposed at a periphery thereof,the plurality of leads having lead inner portions and lead outerportions, the inner portions having first surfaces, second surfaces, andlead vias extending through the lead inner portions; providing a firstchip stack comprising at least one chip having an active surface, a backsurface, a plurality of bonding pads embedded in the active surface, anda plurality of chip vias extending from the plurality of bonding padsthrough the chip to the back surface without passing through the bondingpads, wherein the first chip stack is positioned on the first surfaceswith the first active surface paralleling the first surfaces;positioning the first chip stack with a first active surface facing thefirst surfaces and with a first plurality of bonding pads aligned withand contacting the lead inner portions, and coaxially aligning theplurality of chip vias of said chip with the lead vias; providing asecond chip stack comprising at least one chip having an active surface,a back surface, a plurality of bonding pads embedded in the activesurface, and a plurality of chip vias extending from the plurality ofbonding pads through the chip to the back surface without passingthrough the bonding pads; and positioning the second chip stack with asecond active surface facing the second surfaces and with a secondplurality of bonding pads aligned with and contacting the lead innerportions, wherein the second chip stack is positioned on the secondsurfaces with the second active surface paralleling the second surfaces,and coaxially aligning the plurality of chip vias of said chip with thelead vias.
 2. The method as set forth in claim 1, further comprisingdisposing an insulated coating on inside walls of the plurality of chipvias.
 3. The method as set forth in claim 1, wherein providing a firstchip stack comprising: providing a first chip and a second chip, thefirst and second chips being joined such that the active surface of thesecond chip faces the back surface of the first chip; and coaxiallyaligning the plurality of chip vias of the first and second chips withthe lead vias.
 4. The method as set forth in claim 3, further comprisingelectrically connecting the plurality of bonding pads of chips that forma stack.
 5. The method as set forth in claim 4, wherein electricallyconnecting the plurality of bonding pads comprises disposing conductivematerial in the plurality of chip vias, the conductive material beingelectrically connected to the plurality of bonding pads.
 6. The methodas set forth in claim 5, further comprising electrically connecting theplurality of bonding pads to the lead inner portions.
 7. The method asset forth in claim 1, wherein providing a second chip stack comprises:providing a third chip and a fourth chip, the third and fourth chipsbeing joined such that the active surface of the fourth chip faces theback surface of the third chip; and coaxially aligning the plurality ofchip vias of the third and fourth chips with lead vias.